Modular Placement Machine NPM-WX, WXS

Mounting machines (modular), printers, insertion machines as well as mounting-related software and electronic materials.

Flip-chip Bonder MD-P300

Bonders, dry etchers, cleaners, and dicers.

COG/FOP Dual-purpose Bonder FPX007CG/FP

FPD bonding of cellphones, in-vehicle displays, tablets, and notebook PCs.

Ultrahigh Accurate 3-D Profilometer UA3P Series

Ultrahigh Accurate 3-D Profilometer and measuring systems.


Electronic Component Mounting-related Systems

High- and medium-speed modulars, screen printers, insertion machines, and laser marking machines


High-speed dual/single-lane machines

Increases throughput, improves quality, and reduces costs through automation and manpower saving on the mounting floor.


Modular Placement Machine NPM-GH

Modular Placement Machine

NPM-GH

This edge device achieves industry-leading productivity and mounting quality for Autonomous Factory. Proposes control of irregularities in the 5Ms and elimination of skill-dependent work.

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Modular Placement Machine NPM-DX

Modular Placement Machine

NPM-DX

Increases throughput by manpower saving on the mounting floor. Extended functionality for the device industry.

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Modular Placement Machine NPM-WX, WXS

Modular Placement Machine

NPM-WX, WXS

Covers a wider range of production types by supporting a variety of supply units and increases throughput by manpower saving on the mounting floor.

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Production Modular NPM-D3A

Production Modular

NPM-D3A

Adoption of the latest 16-nozzle head V3. Advancement of head drive unit motion control.

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Production Modular NPM-TT2

Production Modular

NPM-TT2

Direct connectivity with NPM-D3A/W2. Selectable and configurable supply unit specifications.

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Production Modular NPM-W2/W2S

Production Modular

NPM-W2, W2S

Implements high-productivity and high-quality with variable-mix and variable-volume production. Supports large components and PCBs.

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Medium-speed single-lane machines

Features high versatility and adaptability to a variety of production conditions. Ideal as a one-machine solution


Modular Placement Machine AM100

Modular Placement Machine

AM100

Highly versatile one-machine solution that supports a variety of PCBs and production types.

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Modular Placement Machine VM Series

Modular Placement Machine

VM series

A compact and high-performance model has been realized that can flexibly handle everything from high-speed production to high-mix, low-volume and prototype production.

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Screen printers


Screen Printer NPM-GP/L

Screen Printer

NPM-GP/L

Optimizes the screen printing process. Equipped with automation functions, also capable of high-accuracy screen printing.

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Screen Printer SPV-DC

Screen Printer

SPV-DC

Achieves high-efficiency production and compactness of dual-lane. Provides the best functionality for customers production style.

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Screen Printer SPV

Screen Printer

SPV

Total printing cycle time is 10 seconds including transfer, recognition and cleaning. Printing both sides of PCB by one machine.

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Insertion machines


Odd-form Component Insertion Machine NPM-VF

Odd-form Component Insertion Machine

NPM-VF

Automation of odd-form components insertion process. Various configurations of head tools and machine feeder configurations to adapt to different types of components.

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High Speed Axial Lead Component Insertion Machine AV132

High Speed Axial Lead Component Insertion Machine

AV132

Sequential component supply system with high-speed insertion at 0.12 sec/component and compact design.

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High Density Radial Lead Component Insertion Machine RG131/RG131-S

High Density Radial Lead Component Insertion Machine

RG131/RG131-S

High-speed insertion of large-size components at 0.25 sec/component. In addition to 2-pitch, 3-pitch or 4-pitch specifications are selectable. Supports large-size PCBs as an option.

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High Speed Radial Lead Component Insertion Machine RL132

High Speed Radial Lead Component Insertion Machine

RL132

Achieves high productivity through high-speed insertion at 0.14 sec/component. Realizes various operation modes with the 2-part component supply system.

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Mounting software

Our software solutions to connect operations across the entire mounting floor and entire factory.


Manufacturing Operations Management System MOM

Manufacturing Operations Management System MOM

Increases throughput by manpower saving on the mounting floor. Extended functionality for the device industry.

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Mounting Floor Integrated Management

Mounting Floor Integrated Management

Covers a wider range of production types by supporting a variety of supply units and increases throughput by manpower saving on the mounting floor.

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APC System

APC System

Equipped with the latest 16-nozzle head V3. Features advance motion control of the head drive unit.

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Electronic materials

Environmentally-friendly and highly durable electronic materials for mounting.


Electronic materials

Electronic materials series

Low-temperature fast-curing materials that maintain high quality even when used for new methods or difficult mounting.


Device-related Systems

Machines, processes, materials, and software for high-quality semiconductor manufacturing from high-precision wafer processing to fine bonding of bare ICs


Die bonders and flip-chip bonders


Die Bonder MD-P200

Die Bonder

MD-P200

Bonding device that is compatible with various bonding processes for state-of-the-art device assembly.

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Flip-chip Bonder MD-P300

Flip-chip Bonder

MD-P300

Supports φ300 mm wafer supply. Realizes high-speed and high-accuracy flip-chip bonding applicable to COW bonding too.

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Flip-chip Bonder MD-P200US2

Flip-chip Bonder

MD-P200US2

Specialized ultrasonic flip-chip machine. Uses proprietary US tool and achieves a consistent quality.

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Dry etcher


Dry Etcher APX300

Dry Etcher

APX300

Housing multiple devices in one box contributes to increase in area productivity.

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Dry Etcher APX300 (S option)

Dry Etcher

APX300 (S option)

The E620 process chamber with extensive track record is bonded on the latest APX300 platform.

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Plasma cleaner


Plasma Cleaner PSX307

Plasma Cleaner

PSX307

Equipped with a loader and unloader. For PCBs.

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Plasma Cleaner PSX307A

プラズマクリーナー

PSX307A

Large chamber. PCB/wafer selectable.

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Plasma dicer


Plasma Dicer APX300-DM

Plasma Dicer 

APX300-DM

Single chamber configuration to find extensive applications ranging from research development to
mass-production.

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APX300-PD

Plasma Dicer 

APX300-PD

A multi-chamber system (up to 4 chambers ) that realizes automation and high productivity in semiconductor factories. 

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Display-related Systems

Machines and processes for high-quality FPD bonding of cellphones, in-vehicle displays, tablets, and notebook PCs


COG/FOP Dual-purpose Bonder FPX007CG/FP

COG/FOP Dual-purpose Bonder

FPX007CG/FP

By changing component supply units, four different bonding (COG/FOG/FOP/COP) enabled.

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COP/FOP Dual-purpose Bonder FPX007CG/FP2

COP/FOP Dual-purpose Bonder

FPX007CG/FP2

Equipped with advanced functions essential for flexible AMOLED production. The bonding quality and productivity cultivated through COG bonding for LCDs are also realized in COP/FOP bonding for OLEDs.

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FOG/FOF Dual-purpose Bonder FPX007FG/FF

FOG/FOF Dual-purpose Bonder

FPX007FG/FF

Flexible support for FOF mounting on TCP with panel flipping unit. Increases production quality in combination with our mounting inspection machine

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Impression Inspection Machine FPX007AI

Impression Inspection Machine

FPX007AI

High-speed inspection of all pins of flexible OLED panels. High-speed tracking AF and MBR detection method optimized for plastic panels.

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COGボンダー FPX105CG

COG Bonder

FPX105CG

COG bonding technology we have been developing realizes further bonding quality and productivity improvement and an advanced COG bonder that is easier to use.

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COG Bonder FPX005CG

COG Bonder

FPX005CG

COG bonder supporting two sides bonding of panels up to sizes of 1-inch to 7-inch.

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FPC Bonder FPX105FG

FPC Bonder

FPX105FG

Support wide range of FPC bonding from ones used for cellphones/smart phones to those for tablets or notebook PCs.

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Impression Inspection Machine FPX101AI

Impression Inspection Machine

FPX101AI

High-speed, high-accuracy inspection of COG/FOG mounting conditions of LCD and AMOLED panels. Equipped with an auto-focus camera to achieve an inspection speed time of 3 s/panel.

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Measuring systems

High-accuracy measurement technologies that support manufacturing


Ultrahigh Accurate 3-D Profilometer UA3P Series

Ultrahigh Accurate 3-D Profilometer

Measures aspheric lenses, free-form curved mirrors, and their molds at a maximum accuracy of 0.01 um. Easy to operate and capable of speedy feedback to processing.

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Exhibition and Seminar Information

展示会・セミナーの紹介

Information on current seminars and exhibitions is posted here. Information on past seminars and exhibitions is also available.

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Panasonic support

Global network

Global network

Our solid network delivers high-quality and uniform service to customers around the world regardless of time and region.

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Membership Website P-Web

Membership Website P-Web

This is a membership website for customers of electronic component mounting systems, semiconductor-related systems, and FPD-related systems.

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Technical Center

Technical Center

Customers can experience actual circuit board manufacturing using their own components and materials.

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Line simulation

Line simulation

Tact simulation can be performed according to the mounted components and supply form.

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Mounting feasibility study

Mounting feasibility study (nozzle selection)

We propose the optimum nozzle for the mounted components.

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Maintenance solution

Maintenance solution

Panasonic provides reliable lifetime product support to customers ranging from installation to replacement.

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Library

ビデオライブラリ_3カラム写真

Video library

You can view a list of product and business introduction videos.
We will be adding new videos as they become available.

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Feature stories about our technology


Mounting Machines and Proprietary Systems That Support Production of Let’s Note Computers

Mounting Machines and Proprietary Systems That Support Production of Let’s Note Computers

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Panasonic’s vision for a sustainable future

Initiatives for Mounting Machines under Panasonic Green Impact

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Inquiries

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