Electronic Component Mounting/Device/Display related facilities

New Content

Solution

Support for various PCBs and production formats

As PCBs become more diverse, each industry demands a variety of component mounting needs, such as thin and large PCBs, and small component and high-density mounting.Panasonic offers solutions that support various PCBs, as well as solutions that achieve high quality and productivity.

New Product

High Speed Radial Lead Component Insertion Machine

RL133

Compatible with large component support and high-speed insertion of 0.14 seconds/component and adopting exclusive system solution for AI machines.

Updated Content

About Dry Etcher

Examples of LED and power devices, and communication devices and MEMS and sensors

New Content

Solution

Respond to Automation and Manpower Saving

Automation solutions for our printing and mounting machines. These solutions help reduce labor, improve stability, and improve productivity at production sites, thereby helping to solve problems at the sites.

New Product

Flip Chip Bonder

MD-P300HS

New flip chip bonder that improves semiconductor manufacturing productivity and realizes high-quality and high-precision bonding.

New Content

Solution

Respond to Parts Diversification

We provides customers with optimal solutions for their diverse parts mounting needs, including small, large, and odd-shaped parts.

Updated Content

Modular Placement Machine

NPM-GH

This edge device achieves industry-leading productivity and mounting quality for Autonomous Factory. Proposes control of irregularities in the 5Ms and elimination of skill-dependent work.

New Product

Modular Placement Machine

NPM-GW

The basic performance has been improved by renewing the core units, such as the placement head and recognition camera. It now supports a wide range of components and PCBs.