Strengths of Panasonic display-related systems
High-quality and high-reliability mounting process solutions with the industry’s number-one track record
The FPD manufacturing process has a step of mounting a driver IC and FPC on a panel. This step requires a particularly high level of precision. Panasonic offers our time-tested high-quality and high-reliability mounting solutions and mass production systems that dependably manufacture conforming products.
List by process and application
Display-related systems lineup by process and application
COP/FOP Dual-purpose Bonder
Equipped with advanced functions essential for flexible AMOLED production. The bonding quality and productivity cultivated through COG bonding for LCDs are also realized in COP/FOP bonding for OLEDs.
Impression Inspection Machine
High-speed, high-accuracy inspection of COG/FOG mounting conditions of LCD and AMOLED panels. Equipped with an auto-focus camera to achieve an inspection speed time of 3 s/panel.
Features of Panasonic display-related systems
IC/TCP bonding is available by changing the component supply units.
Our original fixed-point mounting (temporary bonding) ensures high-precision mounting.
Equipped with a universal tool for temporary bonding.
Highly adaptable to various shapes and sizes of FPCs
Impression inspection machines
High-speed, high-accuracy inspection of ACF bonding conditions of mounted components.
Capable of inspecting all mounted components and pins using a line scan camera