Kadoma Demonstration Center

The Kadoma site has a plasma dicing demonstration center, a dry etching demonstration area, and a plasma cleaning demonstration area.

We have the necessary devices for evaluation, and inspection devices for demonstration to obtain accurate results, and we accept demonstration requests from customers.


Kadoma site
Kadoma site
Minoshima site
Minoshima site

Device and demonstration support details

Kadoma site [Plasma dicing demonstration center]

Support details:

Demonstrations of plasma dicing for silicon wafers with a diameter of 200 mm or 300 mm
(Wafers with a size of 200 mm or less are also supported)

Main devices:

  1. Plasma Dicer APX300-DM
  2. Peripheral processing devices
    • Back grinder:
      Thins wafers to a specified thickness
    • Lithography:
      Applies a protective layer of plasma irradiation to the wafer to determine the dicing position
    • Laser patterning:
      Forms dicing lines
  3. Inspection devices
    Measurement of processing steps and film thickness, electron microscopy, etc.
門真実証センターの装置及び実証対応内容

Image: One-stop demonstration service

We have all the necessary devices for processes before and after plasma dicing to provide a one-stop demonstration service.


Kadoma site [Dry etching demonstration area]

Support details:

Dry etching demonstrations of wafers with a diameter of 200 mm or less

Main devices:

  1. Dry Etcher APX300APX300-S
  2. Inspection devices
    Measurement of processing steps and film thickness, electron microscopy, etc.
Kadoma site [Dry etching demonstration area]

Kadoma site [Plasma cleaning demonstration area]

Support details:

Effectiveness of plasma cleaning PCBs and wafers

Main devices:

  1. Plasma Cleaner PSX307S, PSX307MPSX307A
  2. Inspection devices
    Water droplet contact angle measurement, surface elemental analysis, film thickness measurement, electron microscopy, etc.
PSX307S, PSX307A

Minoshima site [Die and flip-chip bonding demonstration area]

Support details:

Die bonding and flip-chip demonstrations

Main devices:

  1. Die Bonder MD-P200DA
  2. Flip Chip Bonder MD-P200US2MD-P300
  3. Inspection devices
    Transmission X-ray device, die shear tester, metallographic microscope, etc.
美野島拠点

Location

Kadoma site

2-7 Matsubacho, Kadoma City, Osaka 571-0056

Minoshima site

4-1-62 Minoshima, Hakata-ku, Fukuoka City, Fukuoka 812-8531


For details, please contact one of our sales companies or sales representative.
Alternatively, please use the Inquiry Form at the bottom of this page to contact us.

Inquiries

ご相談窓口
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受付時間 9:00~17:00(土日、祝日、年末年始、弊社所定の休日を除く)