Kadoma Demonstration Center
Kadoma Demonstration Center
The Kadoma site has a plasma dicing demonstration center, a dry etching demonstration area, and a plasma cleaning demonstration area.
We have the necessary devices for evaluation, and inspection devices for demonstration to obtain accurate results, and we accept demonstration requests from customers.
Device and demonstration support details
Kadoma site [Plasma dicing demonstration center]
Support details:
Demonstrations of plasma dicing for silicon wafers with a diameter of 200 mm or 300 mm
(Wafers with a size of 200 mm or less are also supported)
Main devices:
- Plasma Dicer APX300-DM
- Peripheral processing devices
- Back grinder:
Thins wafers to a specified thickness - Lithography:
Applies a protective layer of plasma irradiation to the wafer to determine the dicing position - Laser patterning:
Forms dicing lines
- Back grinder:
- Inspection devices
Measurement of processing steps and film thickness, electron microscopy, etc.
We have all the necessary devices for processes before and after plasma dicing to provide a one-stop demonstration service.
Kadoma site [Plasma cleaning demonstration area]
Support details:
Effectiveness of plasma cleaning PCBs and wafers
Main devices:
- Plasma Cleaner PSX307S, PSX307M, PSX307A
- Inspection devices
Water droplet contact angle measurement, surface elemental analysis, film thickness measurement, electron microscopy, etc.
Minoshima site [Die and flip-chip bonding demonstration area]
Support details:
Die bonding and flip-chip demonstrations
Main devices:
- Die Bonder MD-P200DA
- Flip Chip Bonder MD-P200US2, MD-P300
- Inspection devices
Transmission X-ray device, die shear tester, metallographic microscope, etc.
Location
Kadoma site
2-7 Matsubacho, Kadoma City, Osaka 571-0056
Minoshima site
4-1-62 Minoshima, Hakata-ku, Fukuoka City, Fukuoka 812-8531
For details, please contact one of our sales companies or sales representative.
Alternatively, please use the Inquiry Form at the bottom of this page to contact us.