Device-related Systems – MD-P300 Flip-chip Bonder
Flip Chip Bonder MD-P300
A flip-chip bonder for high-speed, high-quality placement of bare ICs for cutting-edge devices
MD-P300 Flip-chip Bonder
Main Features
- The basic structure comprises fixed-point pickup and placement that supports supply of wafers up to ⌀300 mm
- Process change is possible by switching the bonding tool(Compatible with GGI/C4/TCB)
- High-precision placement of ± 5 um is achieved using the placement nozzle where the chip backside recognition result obtained by a flip camera is feed-forwarded to handling
- For productivity, high-speed placement of 5,500 CPH (production output per hour) is achieved
The MD-P300 Flip-chip Bonder is process-flexible, combining flip-chip and thermosonic bonding in a single, small-footprint solution.The MD-P300 contributes to the cost-effective production (high yield, high throughput) of value-added devices. The MD-P300 can achieve high speed and high accuracy bonding through its low gravity point and lightweight bonding head. The MD-P300 supports 300 mm (12") wafers, and is an ideal solution for COB hybrid assembly in combination with an in-line Panasonic SMT placement machine.The MD-P300 is capable of fast cycle times and a placement accuracy of +/-5 μm at 0.5 seconds per IC (dry run) - with thermosonic processes at 0.65 seconds, including process times.
MD-P300 Flip-chip Bonder
Strengths and Features
Main Specifications
| MD-P300 Flip-chip Bonder | |
|---|---|
| Placement Accuracy | XY ( 3σ at Panasonic conditions ) : ±5 μm |
| Substrate dimensions | L 50 mm × W 50 mm to L 330 mm × W 330 mm ( Heating specifications : L 330 mm × W 220 mm ) |
| Die dimensions (mm) | L 1 mm × W 1 mm to L 25 mm × W 25 mm ( Thermosonic : L 7 mm × W 7 mm） |
| Die Supply | Wafer frame 12 inches ( Option : 8 inches ) |
| Bonding Load | VCM head : 1 N to 50 N ( Option : 2 N to 100 N ) |
Footnotes
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