Strengths of Panasonic device-related systems
Total support for customers from verification to mass production
We provide full support to our customers through the verification of each semiconductor manufacturing process at our verification center.
List by process
Semiconductor-related system lineup by process
Die bonders and flip-chip bonders
The MD-P series high-performance bonders contribute to the miniaturization and functionality enhancement of devices and modules.
Capable of high-quality mounting of various devices, improving the yield.
APX300 is a batch-type dry etching machine capable of high-speed and high-precision processing.
A variety of processing technologies accumulated through mass-production contribute to the development and production of devices such as LEDs, SAW-F, and MEMS.
The PSX307 series parallel plate plasma cleaners are designed for PCB cleaning and surface modification, and ready for automatic transfer. They improve the adhesion and bonding performance during the packaging process, ensuring the high quality required for communication and automotive devices.
APX300-DM is a plasma dicing machine capable of high-speed and high-precision processing.
Damage- and particle-free processing with a reduced dicing width improves processing quality and productivity.
Features of Panasonic semiconductor-related systems
The lineup of MD-P series provides the optimum mounting accuracies and methods for customers’ various devices. The MD-P300 series, which supports FOWLP, and the MD-P200 series, which uses Panasonic’s original ultrasonic technology, contribute to the production of miniaturized packages.
The APX300 generates a high density and highly uniform large-area plasma, contributing to the production of devices such as SAW-F, power devices, LEDs, and MEMS. The multiple ESC electrodes directly pick up individual PCBs to improve the cooling efficiency and reproducibility.
The PSX307 series contributes to high-quality packaging with Panasonic’s original plasma technology that help modify the surfaces of objects, leading to the improvement of the bonding performance for wire bonding and flip-chip bonding and wettability of mold and underfill materials.
APX300-PD is capable of damage- and chipping-free dicing while achieving higher productivity than the blade or other conventional methods. The particle-free dicing of chip components of various shapes and layouts contributes to the production of advanced packages.