Device-related Systems
Strengths of Panasonic device-related systems
Total support for customers from verification to mass production
We provide full support to our customers through the verification of each semiconductor manufacturing process at our verification center.
List by process
Semiconductor-related system lineup by process
List of Solutions
Updated Content
About Dry Etcher
Examples of LED and power devices, and communication devices and MEMS and sensors
About Plasma Dicer
Introduction for the challenges of dicing with blades and the advantages of plasma dicers
About Bonder
High-precision multi-die bonding, continuous stack bonding, and flip-chip bonding are proposed
Products
Dry etchers
APX300 is a batch-type dry etching machine capable of high-speed and high-precision processing.
A variety of processing technologies accumulated through mass-production contribute to the development and production of devices such as LEDs, SAW-F, and MEMS.
Dry Etcher
APX300
Housing multiple devices in one box contributes to increase in area productivity.
Dry Etcher
APX300 (S option)
The E620 process chamber with extensive track record is bonded on the latest APX300 platform.
Plasma dicer
APX300-DM and APX300-PD are plasma dicing machine capable of high-speed and high-precision processing. Plasma dicing is uses a chemical reaction process with plasma, damage- and particle-free processing with a reduced dicing width improves processing quality and productivity.
Panasonic will propose solutions for plasma dicing including pre- and post-processing.
Plasma Dicer
APX300-DM
Single chamber configuration to find extensive applications ranging from research development to
mass-production.
Plasma Dicer
APX300-PD
A multi-chamber system (up to 4 chambers ) that realizes automation and high productivity in semiconductor factories.
Plasma cleaners
The PSX307 series parallel plate plasma cleaners are designed for PCB cleaning and surface modification, and ready for automatic transfer. They improve the adhesion and bonding performance during the packaging process, ensuring the high quality required for communication and automotive devices.
Die bonders and flip-chip bonders
The MD-P series high-performance bonders contribute to the miniaturization and functionality enhancement of devices and modules.
Capable of high-quality mounting of various devices, improving the yield.
New
Flip-chip Bonder
MD-P300HS
New flip chip bonder bonder that improves semiconductor manufacturing productivity and realizes high-quality and high-precision mounting。
Die Bonder
MD-P200
Bonding device that is compatible with various bonding processes for state-of-the-art device assembly.
Flip-chip Bonder
MD-P300
Supports φ300 mm wafer supply. Realizes high-speed and high-accuracy flip-chip bonding applicable to COW bonding too.
Flip-chip Bonder
MD-P200US2
Specialized ultrasonic flip-chip machine. Uses proprietary US tool and achieves a consistent quality.
Related products
Screen Printer
NPM-GP/L
Optimizes the screen printing process. Equipped with automation functions, also capable of high-accuracy screen printing.
Exhibition and Seminar Information
Information on current seminars and exhibitions is posted here. Information on past seminars and exhibitions is also available.
Custom Service
Maintenance solution
Panasonic provides reliable lifetime product support to customers ranging from installation to replacement.
Demonstration Center
Dry etching / Plasma dicing / plasma cleaning / Die bonding / Flip-chip bonding
- Verification
- Demonstration
Library
Video library
You can view a list of product and business introduction videos.
We will be adding new videos as they become available.
Contact
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