Plasma Cleaner [Solution]

Do you face any of these problems?

Need to improve bonding reliability of wire bonding
Need to improve adhesion of underfill
Need to improve flip-chip performance, solder bump performance, and die attach performance by cleaning/modifying wafers
Need to improve the quality of solder bumps by removing resin residue on the wafer bump top
Need to improve pad quality by removing plastic residue in via holes (desmear)

▲Case studies of plasma application in packaging process

Model	PSX307A	PSX307
Classification	PCB/Wafer application	PCB application
Exterior	Contributing to wafer level manufacturing of up to 300 mm by taking advantage of high output, high productivity and damage-free treatment	Contributing to device manufacturing processes by achieving high output, high productivity, and damage-free processing
Features	Large vacuum chamber increases the number of PCBs that can be treated simultaneously, improving productivity Unique plasma monitoring function monitors plasma stability in real time to avoid damage to PCB due to abnormal discharge Newly added traceability function helps assure process quality Compatible with φ300 mm wafer (with or without ring), contributes to wafer level packaging	Improves metal bonding and resin adhesion by cleaning/modifying PCB surfaces with plasma Improves bonding performance in wire bonding and flip-chip bonding of various metals Improves adhesion of molded resin encapsulants and underfill significantly Unique plasma monitoring function monitors plasma stability in real time to avoid damage to PCB due to abnormal discharge