Device-related Systems – PSX307A Plasma Cleaner
Plasma Cleaner PSX307A
A parallel plate plasma cleaner for PCBs with automatic transfer
PSX307A Plasma Cleaner
Main Features
- Chamber configuration that achieves both in-plane uniformity and etching rate
- Our original lifting unit can handle PCBs that are thin and warped and PCBs with components on the backside
- Original plasma monitor function avoids abnormal discharge and enables damage-free processing
- Traceability is ensured due to online operation
PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. It can handle wafers up to ⌀300 mm (with or without dicing ring), and process four 77.5 mm wide PCBs simultaneously.
PSX307A Plasma Cleaner
Strengths and Features
Application example
Wafer level packaging
Wafer surface modification before die-attach
Bump cleaning before flip-chip bonding
Removal of molding resin residue on the wafer bump
Removal of resin residue from via holes(desmear)
Substrate level
Bondability
Adhesion
Related solutions
Main Specifications
| PSX307A Plasma Cleaner | |
|---|---|
| Cleaning Method | Parallel plate RF back-sputtering method
|
| Gas for electrical discharge | Ar ( Option：O2 , O2 + He ) |
| Power Source | 1-phase AC 200 / 208 / 220 / 230 / 240 ±10 V , 50 / 60 Hz , 6.00 kVA
|
Footnotes
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