Plasma Dicer APX300-DM
The processing in APX300-DM uses a chemical reaction process with plasma, offering a clean processing without mechanical dust, debris, vibration, and water pressure caused by the existing blades.
- Dicing of whole wafer's surface at one time without causing damage, achieving high chip strength
- Panasonic's original process enables various kinds of semiconductor wafer dicing
- Singleor multi-chamber system can be deployed according to the production volume