Device-related Systems – MD-P200US2 Flip-chip Bonder
Flip Chip Bonder MD-P200US2
A bonder developed for cutting-edge small devices, which is exclusively used for ultrasonic flip chip bonding
MD-P200US2 Flip-chip Bonder
Main Features
- The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm
- Proprietary US heating head with stability and high rigidity is used for placement, achieving high quality metal bonding
- Real-time US monitoring function enables process control such as traceability
- Offers a full range of quality control functions such as post-bonding inspection, bump inspection, nozzle inspection, etc
Contribute to low cost production for high value added devices ( High yield and high productivity )
Productivity improved by 11 %. ( compared with MD-P200US )
Realize high quality metal joint, thanks to stable ultrasonic vibration provided by high rigidity US head with heating function.
Productivity improved by 11 %. ( compared with MD-P200US )
Realize high quality metal joint, thanks to stable ultrasonic vibration provided by high rigidity US head with heating function.
MD-P200US2 Flip-chip Bonder
Main Specifications
| MD-P200US2 Flip-chip Bonder | |
|---|---|
| Placement Accuracy | XY ( 3σ at Panasonic conditions ) : ±7 μm |
| Substrate dimensions | L 50 mm × W 30 mm to L 120 mm × W 120 mm |
| Die dimensions (mm) | L 0.25 mm × W 0.25 mm to L 6 mm × W 6 mm |
| Die Supply | Wafer frame ( Max.8 inch ) , Tray |
| Bonding Load | VCM head for thermosonic process : 1 N to 50 N ( Option : 2 N to 100 N ) |
Footnotes
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