Dry Etcher [Solution]
Do you face any of these problems?
- Need to achieve high productivity
- Need to achieve increased brightness of LED
- Need to achieve high resolution processing of compounds
- Need to perform etching of non-volatile materials
List of dry etcher applicable applications
▲Examples of utilization and application of various materials
Panasonic dry etching solutions
| Classification | Single wafer/batch type dry etcher | Single wafer type dry etcher |
| Model |
APX300 |
APX300-S |
|---|---|---|
| Exterior | Housing multiple devices in one box increases the area productivity |
The E620 process chamber with extensive track record is bonded on the latest APX300 platform |
| Features |
|
|
| Target wafer | Multiple wafers Batch treatment (tray specification) |
Examples of applications in compound semiconductor
Examples of application in LED and optical communication devices
▲Case studies of application and processing of LED
Examples of applications in power device
Examples of applications in high-frequency communication devices
Examples of applications in MEMS and sensors
MEMS/Sensors
Processing of dielectric films, metals, and silicon used in gyroscopes, pressure sensors, printer heads, etc.
■Piezoelectric MEMS, PZT thick film etching (FS-ICP plasma source application)
W to W stability
PZT E/R ≧ 50 nm/min
Uniformity
In wafer ≦ ±5%
W to W ≦ ±1%
PR selectivity ≧ 0.7
Pt selectivity ≧ 8
■Non-volatile material etching (FS-ICP plasma source application)
NiFe/NiCo etching
E/R ~100nm/min.
Unif. ≦ ±5%
PR Sel. ≧ 0.6~1.5
No fence, No corrosion
Au etching
E/R ≧400nm/min.
Unif. ≦ ±5%
PR Sel. ≧ ~2.0
No fence
Pt etching
E/R ≧200nm/min.
Unif. ≦ ±5%
HM Sel. ≧ 10
No fence
Pt/SBT/Pt etching
E/R ≧140nm/min.
Unif. ≦ ±5%
0.4um L/S
No fence
Related products
Dry Etcher
APX300
Housing multiple devices in one box contributes to increase in area productivity.
Dry Etcher
APX300 (S option)
The E620 process chamber with extensive track record is bonded on the latest APX300 platform.