Die Bonder MD-P200
MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices.
- The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm.
- In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected.
- Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors