Plasma Dicer [Solution]

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Model	APX300-DM	APX300-PD
Exterior	Single chamber configuration supports a wide range of applications from R & D to mass production	Multi-chamber system with up to 4 chambers (Class 10 compatible), ideal for mass production lines
Features	Equipped with ultra-high density enhanced-ICP plasma source for high rate high-speed machining Continuous machining of different materials in the same chamber (e.g., Si + insulating film※) ※Applicable range may vary depending on processing conditions and material characteristics.	Equipped with a Dual-Enhanced plasma source to achieve excellent processing uniformity by controlling the distribution of high-density plasma Utilizing in-situ wafer temperature measurement function to achieve damage-free high-speed processing by temperature control Allows continuous processing of different materials in the same chamber (e.g., Si + insulating film※） ※Applicable range may vary depending on processing conditions and material characteristics.。
Target wafer