Plasma Dicer [Solution]
Do you face any of these problems?
- Need to eliminate damage and chipping
- Need to achieve high productivity by batch treatment with plasma
- Need to suppress the occurrence of dust/particle that causes lower yields
- Need to design chip shapes freely
Plasma dicer realizes high productivity by damage-less and clean dicing.
1. No damage and no chipping
- Damage-free, chip-free and improved die strength of chip
- Thin wafer (≦50 μm) can be separated into pieces with low damage
- Capability that helps to separate into pieces with low device damage
2. High productivity and low CoO
- Batch process treatment and high Si processing speed
- Narrow dicing widths (≦5 µm) and narrow kerf margins achieved by chipping or cracking allowing for more chips per wafer
3. Dust-free and particle-less
- Chemical reaction processing by plasma etching, a clean process free from mechanical damages that generates mechanical dust, vibration and water pressure
- Capability to improve yield
- Potential to reduce the number of inspections and inspection points
4. Various chip shape and layout support
- No restrictions of chip shapes and layouts other than a grid
Target machinery and target packages
| Model |
APX300-DM |
|---|---|
| Exterior | Realizes damage free, takes more chips and improves productivity with the plasma dicing technology |
| Features |
|
| Target wafer |
Solutions
Plasma dicing of plastic materials like DAF
▲Process case study
Plasma dicing of laminated wafer such as insulated film and WoW structure
Various other case studies of processing
Related products
Plasma Dicer
APX300-DM
Reduces damages, takes more chips and increases productivity with the next generation plasma dicing technology.