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Environmentally Friendly, High Durability, Fast Curing at Low Temperatures

Electronic Materials Series

Support for New Methods, Quality Assurance, and a Wide Range of High-difficulty Mounting

[For mounting] Adhesive printing method for micro components

We offer total solutions for machines, processes, and adhesives to contribute to your chip downsizing efforts

  • “ADE510D,” Panasonic proprietary adhesive suitable for continuous printing
  • High-aspect printing with a mask thickness of 3 mm supports an aperture diameter of 0.3 mm
Image: Adhesive printing method for micro components

[For mounting] Low-temperature curing adhesive for SMD flow mounting

Range of low-temperature curing adhesives suitable for printing and dispensing methods

  • Adhesive can be applied to 0603 and 1005 size microchip components using the printing method
  • For the printing method, the takt does not depend on the number of application points, and throughput is significantly improved
  • Low-temperature, quick curing reduces thermal damage on materials
Low-temperature curing adhesive for SMD flow mounting

[For mounting] Self-aligning adhesive

Double-sided reflow PCB improves freedom of component placement and contributes to PCB miniaturization

  • Double-sided reflow PCB prevents components from falling during inverted mounting
  • Supports large, top-mounted components
Self-aligning adhesive

[For mounting] BGA/CSP reinforcement methods and materials

We propose the best reinforcement method for each application

  • Corner bonding:
    Efficiently alleviates stress on solder bumps at corners
    Shortens process time and makes repair work easier
  • Under-fill: Low temperature curing with minimal component damage
Image: BGA/CSP reinforcement methods and materials

[For mounting] Low-temperature curing conductive adhesive

Low-temperature curing process expands the adoption scope of components and base materials

  • Low temperature curing (100ºC to 180ºC) reduces thermal damage on components
  • Good electrical conductivity due to silver filler
  • Does not use solvents that cause bleed-out
Image: Low-temperature curing conductive adhesive

[Semiconductor related] Conductive adhesive

Providing quick curing pastes that can contribute to improved productivity and energy conservation

Features common to the DBC series

  • Almost no dripping or stringiness
  • Low-temperature (100°C or so) and quick (180 sec. or so) curing
  • One-component so it’s easy to work with
  • Does not use solvents that cause bleed-out
  • Uses silver fillers with good conductivity and negligent impact on oxidation
Image: Conductive adhesive

[Semiconductor related] Insulating adhesive

Providing quick curing pastes that can contribute to improved productivity and energy conservation

Features common to the DBN series

  • No dripping or stringiness
  • Low-temperature (100°C to 150°C) and quick (1 to 20 min.) curing
  • One-component so it’s easy to work with
  • Does not use solvents that cause bleed-out
Image: Insulating adhesive

Inquiries

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