Proposals for Server Industry

Proposals for Server Industry

Proposals by Industry

Server industry

For the realization of the trending 5G, ultra-high-speed and ultra-low-latency connections, multi-terminal connections, and ultra-high-speed and high-volume communications will become necessary. It is anticipated that high-speed and high-performance CPUs, high-capacity memory allocation, and large, multi-functional PCBs will be required to fulfill these needs. Given this, three major trends in mounting are expected, namely, larger and heavier BGA, an increase in the number of DIMM connectors, and larger and heavier PCBs.


Proposals of Panasonic Connect

To respond to mounting related changes, and industry requirements in the future, Panasonic has prepared solutions by predicting future trends.
First is a solution for mounting of large and heavy BGA packages. In 2023, Panasonic has already succeeded in mounting BGA packages of 120 mm on all four sides, weighing 300 g, and plans to further expand the support range in the future.
Next, Panasonic has prepared solutions for large and heavy PCBs. These solutions support 1,500 mm long PCBs using slide mounting. With improved retention, these solutions can support PCBs of up to 10 kg.

This section introduces items that help realize the above solutions.


To respond to industry requirements in the future, solutions are prepared by predicting future trends


To respond to industry requirements in the future, solutions are prepared by predicting future trends

Solutions and product proposals for the server industry

Products


Screen Printer SPG2

Screen Printer

SPG2

Supports high-accuracy and high-density printing. Enhanced automation and manpower saving functions.

See Details

Modular Placement Machine NPM-WX, WXS

Modular Placement Machine

NPM-WX, WXS

Covers a wider range of production types by supporting a variety of supply units and increases throughput by manpower saving on the mounting floor. 

See Details

Production Modular NPM-W2/W2S

Production Modular

NPM-W2, W2S

Implements high-productivity and high-quality with variable-mix and variable-volume production. Supports large components and PCBs.

See Details

Odd-form Component Insertion Machine NPM-VF

Odd-form Component Insertion Machine

NPM-VF

Automation of odd-form components insertion process. Various configurations of head tools and machine feeder configurations to adapt to different types of components.

See Details

Installed MES software PanaCIM-EE Gen2

Mounting MES Software

PanaCIM-EE Gen2

Support is provided for improvement in QCD in each task related to mounting, through centralized management of the entire mounting floor

See Details

統合ライン管理システム iLNB

Integrated Line Management System

iLNB

Optimization of the entire production line by “connecting” Panasonic machines, non-Panasonic machines, and higher-level systems

See Details

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