The trends in 5G communication encompass ultra-high-speed and ultra-low-latency connections, high-capacity communications, and multi-terminal connections.
In the area of products, we observe evolving trends such as increased power components, enhanced CPU processing capacity, and expanded memory capacity. However, for producing these products, the trend of quality, labor shortage, and cost remains unchanged. From these trends, support for various odd-shaped components and PCBs, mounting of large and heavy BGA, increase in the number of DIMM connectors, and automation and manpower saving are all considered production challenges.
Proposals of Panasonic Connect
This roadmap simplifies the changes in components and PCBs in the 5G communication infrastructure industry. We anticipate that the large BGA will reach a maximum size and weight of □135 mm and 300 g. The number of DIMM connectors will be increased up to 48 per PCB.
In a wide variety of PCBs, the size and weight significantly differ depending on PCBs in the 5G communication infrastructure.
Panasonic proposes forward-looking solutions to address mounting issues caused by these changes.
Trends of PCB in the 5G communication infrastructure
Solutions and product proposals for the server industry
Odd-form Component Insertion Machine
Automation of odd-form components insertion process. Various configurations of head tools and machine feeder configurations to adapt to different types of components.