Modular Placement Machine NPM-GH
NPM-GH
Main Features
- High accuracy ±10 μm for modular placement machine
- Achieves high productivity while supporting a wide range of components
- 5M* process control “APC-5M” for good production and stable operation
* 5M: The variable elements of a production site: huMan, Machine, Material, Method, and Measurement - Various skill-less and manpower-saving features including Auto Setting Feeder
Modular placement machine with high productivity and placement accuracy
This modular mounter achieves both high productivity and high accuracy by improving the basic performance of key units such as the placement head and recognition camera. It is compatible with a wide range of components and a variety of supply units layouts. It also supports a variety of automation and labor-saving functions, including the Auto Setting Feeder (ASF), which automates parts supply work, to flexibly meet the demands of each mounting site.
NPM-GH
Strengths and Features
Supported components range
Max. speed and placement accuracy
Supported PCB size
Supply unit configuration
Component supply units
Problems this product contributes to
Support for a wide variety of components
Supporting wide variety of components, from micro to large.
High quality placement
High quality and high-accuracy placement even when small components such as in the device industry.
Maximize O.E.E by minimizing various losses
Minimizing various losses at production sites, maximizes O.E.E (Overall Equipment Effectiveness), and improves productivity.
Enhance skill-less and labor-saving
Reducing human-dependent work, which is one of the causes of loss and quality degradation, and reducing dependence on specific workers by making them skill-less.
Support for a wide range of components and a variety of supply units layouts
High level of accuracy ±10 μm as a modular placememt machine
High accuracy mode 1 (± 15 μm)/2 (± 10 μm)
Supports mounting at ±10 μm *, the high level of accuracy as a modular placememt machine.When compared with catalog speed (CPH), ±25 μm is approximately 10% better than the conventional our NPM-WX.
※ASF (Auto Setting Feeder) is required for the FC16 head. Please contact us for details.
High productivity mounting of a wide range of components
Placement head (new design)
Flexible head configuration for 0201 parts to large and tall components. Production can be performed with high productivity. When compared with the catalog speed (CPH), the NPM-GW is approximately 58% better than our conventional model at ±25μm condition.
Micro-component mounting
Low load mounting (1.0 N, 0.5 N)
Load applied to components is controlled on a components-by-components basis, load applied to mounting is controlled on a components-by-components basis, and damage to components can be reduced. In addition, mounting can be performed following warpage on the PCB. 1.0 N constant load control, 0.5 N constant load control, and 0.5 N low load nozzle enable optimum mounting of microcomponents.
Adaptable to various supply section layouts
Three types of supply section units
By combining three types of supply section units, you can select a variety of supply section layouts.
※The single tray feeder can be used only in the supply section(rear side).
High quality placement
Measurement function using multi-camera
Component Thickness Measuring Function Multi Camera MC-S: Type 2/Type 3
The thickness of components is measured and the result is reflected in the placement height to further improve placement stability. Simultaneous confirmation of standing and diagonal placement of micro components is possible. The nozzle tip check function periodically checks the nozzle height to improve placement quality.
3D Measurement Function Multi Camera MC-S: Type 3
It is possible to detect coplanarity of all leads such as QFP/SOP and presence/absence of all balls such as BGA/CSP.
Prevention of defective mounting due to mis-setting of components
LCR checker (built-in type)
Prevents defective mounting due to mis-setting of parts by measuring the electrical characteristics of components . Stable measurement is possible due to stable maintenance of components attitude and position by the adhesive material. In addition, high-accuracy measurement is possible regardless of the nozzle used by measuring by pressing down the components with the metal lever.
Maximize O.E.E by minimizing various losses
Unit condition monitoring~analysis to optimize maintenance
APC-5M (option)
To ontrol 5M variation autonomously, unit condition can be monitored, analyzed easily to ensure proper maintenance.
5M Unit conditions are monitored in real time to control variations autonomously, enabling predictive maintenance before conditions deteriorate and preventing errors due to lack of maintenance.
Not only showing the status of each equipment, but also the entire line can be displayed on the LPC (Line Process Controller) screen for line status monitoring, and the status of target units in the line can be broken down for time-series analysis. The status after maintenance can also be checked to determine if maintenance is appropriate.
※5M : huMan, Machine, Material, Method, Measurement
Variation control with inspection machine (AOI/SPI)
APC System (APC-FF/APC-MFB2)
Maintains placement quality by controlling variation in solder printing and component placement in conjunction with the inspection machine.
APC-FF is our unique in-line process control system that feeds forward the mounting position correction amount to the mounter based on the solder position data measured by solder inspection to maintain placement quality.
The APC-MFB2 maintains mounting quality by feeding back component position data measured by the inspection machine (AOI) to the mounting machine after component placement.
Skill-less and labor-saving
Automation of components supply operations
Auto Setting Feeder
Automated supply of 8 to 104 mm wide reels of paper and embossed tape. The loading unit can be used to automate not only new tape supply, but also the next tape supply.
Automatic setting reduces set-up time and skill, while automatic loading eliminates the work for splicing, realize skill-less work.
Error recovery work performed offsite location
Remote Operation
Error recovery operations can be done remotely and efficiently, preventing on-site operators from being late in noticing error signals and allowing on-site operators to concentrate on supplying components, thereby improving productivity and reducing manpower.
Display AOI information on target machine screen when a quality error occurs
AOI information display
When a quality error occurs in AOI, quality error response can be performed skillless to improve operation rate. When a quality error occurs in AOI, information about the target device can be displayed in AOI, and AOI information including images can be displayed in the target device to respond skillless.
Main Specifications
| NPM-GH | |
|---|---|
| PCB dimensions (mm) | Single lane mode:L 50 mm × W50 mm ～ L 510 mm × W 590 mm Dual lane mode:L 50 mm × W50 mm ～ L 510 mm × W 300 mm |
| Placement Head max Speed | 55 500 cph(0.065 s/chip) 51 000 cph(0.071 s/chip) 20 000 cph(0.180 s/chip) |
| Placement Head Placement Accuracy (Cpk≧1) | ±25 μm/chip ±15 μm/chip ±10 μm/chip(* Only when using ASF) |
| Component dimensions | 0201 chip ~ L 120 × W 90 × T 30 or L 150 × W 25 × T 30
|
| Maximum number of components supply (Tape Width: 4 mm, 8 mm calculation) | 80
|
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