Bonder [Solution]
Do you face any of these problems?
- Need to achieve miniaturization of module
- Need to achieve high speed at low cost
We propose high-performance bonders that achieve miniaturization, reduction in thickness and high functionality for devices and modules, including FOWLP
Compared to the method of bonding ICs on the PCB, FOWLP allows thinner designs by inserting a rewiring layer in the PCB layer.
Target machinery and target packages
Solutions
Bonder proposals in FOWLP
Flip-chip bonding method and die attach method are available.
Related products
Flip-chip Bonder
MD-P300
Supports φ300 mm wafer supply. Realizes high-speed and high-accuracy flip-chip bonding applicable to COW bonding too.
Flip-chip bonding (Ultrasonic bonding)
In flip-chip bonding, which achieves miniaturization, Panasonic has especially honed its ultrasonic (US) bonding technology. The MD-P200US2 specially designed for the production of small devices (SAW-F, TCXO, etc.), contributes to customers’ production with its unique US monitoring function and the fastest bonding speed in the industry.
▲Difference in bonding methods
▲Bonding accuracy and productivity when ultrasonic (US) bonding is used
Related products
Die Bonder
MD-P200
Bonding device that is compatible with various bonding processes for state-of-the-art device assembly.
Flip-chip Bonder
MD-P200US2
Specialized ultrasonic flip-chip machine. Uses proprietary US tool and achieves a consistent quality.
Supports various bonding processes
Compared to die bonding alone, this method achieves miniaturization, higher speed, and lower cost by supporting a variety of processes.
(1) Supports high-accuracy multi-die bonding
- Multi-die bonding of microchip dies in close adjacency on narrow pads contributes to module miniaturization
- Miniaturization contributes to cost reduction (base material, Au)
Die: Min 0.25 mm, Max 12 brands
Accuracy: DA; 15 μm/3σ
(2) Supports stack bonding
- Continuous stack bonding contributes to miniaturization of modules and lower cost by reducing intermediate heat treatment
- Miniaturization contributes to cost reduction (base material, Au)
Epoxy: Automatic switching of 2 brands
(3) Supports flip-chip bonding
- Contributes to miniaturization by less wire space
- Contributes to speeding up of processing by reducing wire length
- Contributes to cost reduction (Au→solder) by
C4 bonding
Accuracy: FC; ±7 μm/3σ
Related products
Die Bonder
MD-P200
Bonding device that is compatible with various bonding processes for state-of-the-art device assembly.