Production Modular NPM-W2
NPM-W2
Main Features
- Higher productivity and quality with printing, placement and inspection process integration
- Versatility for large PCBs and components
- 5M* process control “APC-5M” for good production and stable operation * 5M: The variable elements of a production site: huMan, Machine, Material, Method, and Measurement
- Various skill-less and manpower-saving features including Auto Setting Feeder
Highly versatile production modular
This highly versatile model supports a variety of components and supply forms. The machine configuration is 2 head which can install the inspection head and dispensing head, and the component supply section can be installed 30-slot feeder cart and tray feeders cart to support a variety of components. In addition, it supports a variety of automation and manpower saving functions, including the Auto Setting Feeder (ASF), which automates components feeding operations, to flexibly meet the demands of each mounting site.
NPM-W2
Strengths and Features
Supported components range
Max. speed and placement accuracy
Supported PCB size
Supply unit configuration
Configuration example
Component supply units
Problems this product contributes to
Versatility for large components
Supports placement for a wide variety of components, from small to large and odd-form component such as in the automotive and server industries.
Maximize O.E.E by minimizing various losses
Minimizing various losses at production sites, maximizes O.E.E (Overall Equipment Effectiveness), and improves productivity.
Enhance skill-less and labor-saving
Reducing human-dependent work, which is one of the causes of loss and quality degradation, and reducing dependence on specific workers by making them skill-less.
Versatility for large components
Support for large and heavy BGA placement
Support for large and heavy components placement
By using a nozzle that supports large and heavy components and performing a scanning operation according to the component size, the system can support the placement of large and heavy BGA, which is a trend in the server industry. The system detects 15,000 BGA ball recognition.
Increased height support for placement components
Placement for tall components
Placement for tall components avoid interference between placement components and pick-up components, and interference between placement components and head cameras.
Components can be mounted up to 48 mm in height, including PCB thickness.
Maximize O.E.E by minimizing various losses
Unit condition monitoring~analysis to optimize maintenance
APC-5M (option)
To ontrol 5M variation autonomously, unit condition can be monitored, analyzed easily to ensure proper maintenance.
5M Unit conditions are monitored in real time to control variations autonomously, enabling predictive maintenance before conditions deteriorate and preventing errors due to lack of maintenance.
Not only showing the status of each equipment, but also the entire line can be displayed on the LPC (Line Process Controller) screen for line status monitoring, and the status of target units in the line can be broken down for time-series analysis. The status after maintenance can also be checked to determine if maintenance is appropriate.
※5M : huMan, Machine, Material, Method, Measurement
Variation control with inspection machine (AOI/SPI)
APC System (APC-FF/APC-MFB2)
Maintains placement quality by controlling variation in solder printing and component placement in conjunction with the inspection machine.
APC-FF is our unique in-line process control system that feeds forward the mounting position correction amount to the mounter based on the solder position data measured by solder inspection to maintain placement quality.
The APC-MFB2 maintains mounting quality by feeding back component position data measured by the inspection machine (AOI) to the mounting machine after component placement.
Skill-less and labor-saving
Error recovery work performed offsite location
Remote Operation
Error recovery operations can be done remotely and efficiently, preventing on-site operators from being late in noticing error signals and allowing on-site operators to concentrate on supplying components, thereby improving productivity and reducing manpower.
Display AOI information on target machine screen when a quality error occurs
AOI information display
When a quality error occurs in AOI, quality error response can be performed skillless to improve operation rate. When a quality error occurs in AOI, information about the target device can be displayed in AOI, and AOI information including images can be displayed in the target device to respond skillless.
Main Specifications
| NPM-W2 | |
|---|---|
| PCB dimensions (mm) | Single conveyor Batch mounting：L 50 mm × W50 mm ～ L 750 mm × W 550 mm 2-positin mounting：L 50 mm × W50 mm ～ L 350 mm × W 550 mm Dual conveyor Dual transfer ( Batch ):L 50 mm × W50 mm ～ L 750 mm × W 260 mm Dual transfer ( 2-positin ):L 50 mm × W50 mm ～ L 350 mm × W 260 mm Single transfer ( Batch ):L 50 mm × W50 mm ～ L 750 mm × W 510 mm Single transfer ( 2-positin ):L 50 mm × W50 mm ～ L 350 mm × W 510 mm |
| Placement Head max Speed | 42 000 cph ( 0.086 s / chip ) 35 000 cph ( 0.103 s / chip ) |
| Placement Head Placement Accuracy (Cpk≧1) | ±40 μm / chip ±30 μm / chip |
| Component dimensions | 03015 chip ～ L 120 × W 90 × T 30 / T 40 or L 150 × W 25 × T 30 / T 40
|
| Maximum number of components supply (Tape Width: 4 mm, 8 mm calculation) | 120 |
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