Modular Placement Machine VM Series
VM Series
Main Features
- Applicable PCB M size (330 x 250 mm) or less, machine size is greatly reduced by using a single-lane configuration (compared to our company NPM Series/AM 100)
- VM101：
・Achieves high productivity with ±30 μm placement accuracy
・3 types of head can be selected for placement from 0402 components to large components - VM102:
・Combines productivity and versatility with 14 nozzle head
・Supports various production modes with large-capacity supply unit
Modular Mounter for flexible response to a wide variety of production modes
Compact , high-performance entry-level model capable of o ering a wide assortment of variations and flexibly coping with various production modes, ranging from high-speed production to high-mix low-volume / prototype production. The 2 models, VM101 and VM102, offer an optimal line for a wide variety of production modes by selecting 3 different supply unit configurations and heads, and by combining these machines.
VM Series
Strengths and Features
Supported components range of VM101
Supported components range of VM102
Max. speed and placement accuracy of VM101
Max. speed and placement accuracy of VM102
Supply unit configuration of VM101
Supply unit configuration of VM102
Configuration example of VM101
Configuration example of VM102
Component supply units
Problems this product contributes to
Maximize O.E.E by minimizing various losses
Minimizing various losses at production sites, maximizes O.E.E (Overall Equipment Effectiveness), and improves productivity.
Improved versatility
Flexibly cope with a wide assortment of production modes
The combination of machines provides the optimum line for a wide assortment of production modes
- High-speed chip line: For customers who want to increase throughput by mounting chips at high speed
-
High-mix low-volume line: For customers who want to produce a wide variety of products and load a large number of components
-
Front operation: For customers who want to achieve efficient and compact production
High quality placement
Measurement function using multi-camera
Multi-recognition camera
Equipped with camera with the same performance as NPM to improve component recognition.
Possible to build up to type 2 or 3 to realize high-quality placement.
Component Thickness Measuring Function : Type 2/Type 3
The thickness of components is measured and the result is reflected in the placement height to further improve placement stability. Simultaneous confirmation of standing and diagonal placement of micro components is possible. The nozzle tip check function periodically checks the nozzle height to improve placement quality.
3D Measurement Function : Type 3
It is possible to detect coplanarity of all leads such as QFP/SOP and presence/absence of all balls such as BGA/CSP.
Maximize O.E.E by minimizing various losses
Variation control with inspection machine
APC System (APC-FF)
Maintains placement quality by controlling variation in solder printing and component placement in conjunction with the inspection machine.
APC-FF is our unique in-line process control system that feeds forward the mounting position correction amount to the mounter based on the solder position data measured by solder inspection to maintain placement quality.
Main Specifications
| VM101 | VM102 | |
|---|---|---|
| PCB dimensions (mm) | L 330 mm × W 250 mm
| L 330 mm × W 250 mm
|
| Placement Head max Speed | 42 000 cph ( 0.086 s / chip )
| 32 100 cph ( 0.112 s / chip )
|
| Placement Head Placement Accuracy (Cpk≧1) | ±30 μm / chip
| ±40 μm / chip
|
| Component dimensions | 0402 chip ～ L 120 × W 90 × T 30 or L 150 × W 25 × T 30 | 0402 chip ～ L 120 × W 90 × T 28 or L 150 × W 25 × T 28 |
| Maximum number of components supply (Tape Width: 4 mm, 8 mm calculation) | 80
| 160
|
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