Modular Placement Machine AM100
AM100
Main Features
- One-machine solution to meet diverse requirements at various mounting sites
- Equipped with 14-nozzle head which balances between productivity and versatility
- Support for production in various industries through large-capacity component supply sections and large and long PCB
- Wide range of machine configurations and options
Modular mounter for the pursuit of net productivity and high versatility
This modular mounter inherits the various units and functions of our company NPM series of high-speed mounters, achieves high-quality placement, and achieves both high productivity and versatility. In addition to a wide range of components, large-capacity component supply sections ,and large PCB, the combination of a wide range of machine configurations and a plethora of options provides the optimal line for all types of production.
Strengths and Features
Supported components range
Max. speed and placement accuracy
Supply unit configuration
Configuration example
Component supply units
Problems this product contributes to
Improved versatility
By support for a wide variety of components and PCBs, it can flexibly support PCBs used in various industries.
Maximize O.E.E by minimizing various losses
Minimizing various losses at production sites, maximizes O.E.E (Overall Equipment Effectiveness), and improves productivity.
Improved versatility
Support for small-lot production including small amounts of tray components
Manually setting tray feeder in the mounter ( 2 trays ) option
Without reducing the number of rear feeder supply, pallet parts can be supplied.
In addition, maximum 10 kinds of small-cut paper/embossed tape components can be placed on a pallet in a tray for production. (Tray 1 pallet, 10 kind)
1 500mm long PCB capability
Single conveyor long PCB (1 500 mm) specifications
By dividing long PCBs into two mounting areas and sliding in the lengthwise direction, expands lengthwise to a maximum of 1 500 mm.
High quality placement
Measurement function using multi-camera
Multi-recognition camera V2
Equipped with camera same as NPM-X(our company high-speed mounters) series to improve component recognition. Possible to build up to type 2 or 3 to realize high-quality placement.
Component Thickness Measuring Function : Type 2/Type 3
The thickness of components is measured and the result is reflected in the placement height to further improve placement stability. Simultaneous confirmation of standing and diagonal placement of micro components is possible. The nozzle tip check function periodically checks the nozzle height to improve placement quality.
3D Measurement Function : Type 3
It is possible to detect coplanarity of all leads such as QFP/SOP and presence/absence of all balls such as BGA/CSP.
Maximize O.E.E by minimizing various losses
Variation control with inspection machine
APC System (APC-FF)
Maintains placement quality by controlling variation in solder printing and component placement in conjunction with the inspection machine.
APC-FF is our unique in-line process control system that feeds forward the mounting position correction amount to the mounter based on the solder position data measured by solder inspection to maintain placement quality.
Main Specifications
| AM100 | |
|---|---|
| PCB dimensions (mm) | Standard Specification : L 50 mm × W 50 mm to L 515 mm × W 460 mm Long PCB Specification : L 50 mm × W 50 mm to L 1 500 mm × W 460 mm |
| Placement Head max Speed | 35 800 cph (0.1006 s / chip) |
| Placement Head Placement Accuracy (Cpk≧1) | ±40μm / chip |
| Component dimensions | 0402 chip ～ L 120 × W 90 × T 28 or L 150 × W 25 × T 28 |
| Maximum number of components supply (Tape Width: 4 mm, 8 mm calculation) | 160 |
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