NPM-GP/L
NPM-GP/L
Electronics Assembly Systems NPM-GP/L

Screen Printer
NPM-GP/L

Automation and line solutions help maximize O.E.E. with skill-less knowhow
NPM_GPL_24_0401 (1).png

NPM-GP/L

  • NPM-GP/L

Main Features

  • High productivity through support for model changeover and various types of automation during production
  • Real-time monitoring of equipment status optimizes maintenance timing and expands production time
  • Various functions for high-quality printing and stable printing that responds to 5M* changes to reduce defect losses
    * 5M: The variable elements of a production site: huMan, Machine, Material, Method, and Measurement

Screen printer with various automation functions, line solutions, and other features to maintain stable high quality printing

Automation of model changeover and other operations during production, together with appropriately timed maintenance based on equipment condition monitoring, contributes to increased production time. In addition, various functions to realize high quality printing, stable printing by responding to 5M changes, and M2M (Machine to Machine) with solder inspection equipment reduce defect losses.

Strengths and Features

回路形成_NPM-GP/Lコンセプト_英語字幕

Problems this product contributes to

NPM-GP/L_高い生産性

High productivity

High productivity can be achieved by switching models and responding to various types of automation during production.

高品質実装

High printing quality

Various functions for high quality printing and stable printing corresponding to 5M changes reduce defective losses.

High productivity

Automation of model switching operations

Solder transfer (option)

Solder on the mask is automatically collected after the end of production, and then the collected solder is automatically fed into the mask of the next model. The solder can be automatically transferred to the next model without losing the solder shape.

はんだ移載_3カラム(英)

Automatic replacement of bottom receiving pin (option)

When switching models, the bottom receiving pin are automatically collected and placed.

下受けピン自動交換_3カラム(英)

Mask changer (option)

A magazine capable of stocking up to 10 masks is mounted at the rear of the equipment. After production is finished, masks are automatically stored in the magazine, and masks to be used in the next model are set in the equipment.

マスクチェンジャー_3カラム(英)

Work automation during production

Automatic solder supply in a pot with hole (option)

Solder is automatically supplied through hole on the underside of the solder pot. Combined with a residual amount detection sensor, the solder on the mask can be maintained at the proper amount.

穴あきポット式はんだ自動供給_3カラム(英)

Paper-free wiping unit (option)

Cleaning without using cleaning paper or solvents. Paper and solvent can be reduced.

ペーパーフリーワイピングユニット_3カラム(英)

Equipment condition monitoring (preventive and predictive maintenance)

APC-5M (option)

Real-time monitoring of equipment condition. Optimize maintenance timing and expand production time.

APC-5M(リアルタイムユニット監視)_2カラム(英)

High printing quality

アタック角度可変スキージ_2カラム(英)

High Printing Quality

Variable angle attack squeegee (option)

The angle of attack can be set from 45° to 70° in 1-degree increments; in conjunction with the APC-FB (volume) function, the angle of attack is automatically changed.


先曲げ高充填スキージ_2カラム(英)

Pre-bend High Filling Squeegee (option)

This metal squeegee has improved filling performance by bending the tip of the blade. It is as easy to handle as a normal metal squeegee.


材料照合_2カラム(英)

Matching materials (option)

Mask, squeegee, lower receiving block, and solder are collated to prevent material setting errors. Stops the equipment in the event of a miscompare or unmatching.


はんだ粘度フィードバック_2カラム(英)

Solder viscosity feedback (option)

The viscosity of solder on the mask is measured and controlled to maintain the proper viscosity.


マスクテンションフィードバック_2カラム(英)

Mask Tension Feedback (option)

Measure mask tension before printing and change plate separation operation.


溶剤吐出量フィードバック_2カラム(英)

Solvent Discharge Feedback (option)

Monitors the amount of solvent discharged during wet cleaning and keeps the amount discharged at the correct level.


Printing condition optimization control ( APC-5M ) (option)

Based on the SPI results, the printing pressure, squeegee speed, and plate separation speed are changed to achieve and maintain the optimum printing condition (volume).


APC-FB ( 位置 )_3カラム(英)

APC-FB (Position) (option)

Automatically corrects print position and volume based on SPI results. Two options are available: position correction and volume correction.
APC-FB ( volume ) controls volume by changing squeegee angle, thus smoothly leading to and maintaining optimal printing conditions.

*Variable angle attack squeegee (optional) is required.


APC-FB ( 体積 )_3カラム(英)

Main Specifications

NPM-GP/L
PCB dimensions (mm)
L 50 mm × W 50 mm ~ L 510 mm × W 510 mm
PCB exchange
12.0 s including transport , PCB positioning , PCB recognition , printing , each cleaning operation ( When PCB = L 250 mm × W 150 mm )
Repeatability
2 Cpk ± 3.8 μm ± 3σ ( Panasonic-specified condition )
Screen frame dimensions
L736 mm × 736 mm, L 750 mm × 750 mm, L 650 mm × 550 mm, L 600 mm × 550 mm
L 550 mm × 650 mm, L 584 mm × 584 mm, L 736 mm × 584 mm, L 584 mm × 736 mm

Footnotes

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