Display-related Systems – FPX007CG/FP2 COG/FOP Dual-purpose Bonder
COG/FOP Dual-purpose Bonder FPX007CG/FP2
Bonder with various advanced functions, including an equipment mechanism that minimizes sources of foreign matter
FPX007CG/FP2 COG/FOP Dual-purpose Bonder
Main Features
- COP/FOP bonder dedicated for AMOLED supporting panel size of 1-inch to 8-inch
- Supports four bonding methods (COG/FOG/COP/FOP) with IC/TCP supply units installed together
- The bonding quality and productivity cultivated through COG bonding for LCDs are also realized in COP/FOP bonding for OLEDs
FPX007CG/FP2 COG/FOP Dual-purpose Bonder
Strengths and Features
Equipped with advanced functions essential for flexible AMOLED production
Improved key functions:
- Supports Class 100 cleanliness (foreign matter measure)
- Equipment mechanism that minimizes sources of foreign matter, one of the major causes of defects in flexible AMOLED
- Supports both COP bonding and FOP bonding
- Two component supply units, IC tray and TCP reel, can be installed together (*)
Reduced method switching time
- Two component supply units, IC tray and TCP reel, can be installed together (*)
- Stable mounting quality
- Equipped with dedicated final bonding head for each of IC/TCP (*total 4 heads)
<*Optional functions>
Lineup of Display Bonder & Inspection Equipment
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