Device-related Systems – MD-P200 Die Bonder
Die Bonder MD-P200
A device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices
MD-P200 Die Bonder
Main Features
- The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm
- In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected
Unit Level Manufacturing by the Synchro-motion of Dispensing and Bonding
MD-P200's die bonding is carried out immediately after Epoxy dispensing , thereby making it possible to finish the bonding operation before the Epoxy is deteriorated over time.This realizes stable and high quality bonding at all bond positions on a substrate.Also, the Bonding Stage Camera enables pre-bonding inspection right after Epoxy dispensing and post-bonding inspection right after the bonding of a die ( Option ). This system allows you to realize manufacturing with real-time quality-inspection. The large-sized touch panel and the interactive software realize an easy and reliable operating environment for all users from beginners to experts.
MD-P200 Die Bonder
Main Specifications
| MD-P200 Die Bonder | |
|---|---|
| Placement Accuracy | XY ( 3σ at Panasonic conditions ) : ±7 μm ( Flip bonding ) , ±15 μm ( With pre-centering ) , ±25 μm（Direct bonding ) |
| Substrate dimensions | L 50 mm × W 30 mm to L 280 mm × W 140 mm ( For thermosonic : L 200 mm × W 150 mm ) |
| Die dimensions (mm) | L 0.25 mm × W 0.25 mm to L 6 mm × W 6 mm |
| Die Supply | Wafer frame , Pre-expanded ring , Tray |
| Bonding Load | Pneumatic head : 0.5 N to 10 N ( Option : 1 N to 50 N ) VCM head for thermosonic process : 1 N to 50 N ( Option : 2 N to 100 N ) |
Footnotes
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