Device-related Systems – APX300-DM Plasma Dicer
Plasma Dicer APX300-DM
The processing in APX300-DM uses a chemical reaction process with plasma, offering a clean processing without mechanical dust, debris, vibration, and water pressure caused by the existing blades
APX300-DM Plasma Dicer
Main Features
- System:Single chamber configuration to find extensive applications ranging from research development to mass-production
- Chamber (plasma source):Equipped with a Dual-Enhanced plasma source, achieving high-throughput, high-speed dicing.
- Dicing performance:Possible to continue dicing wafers of different materials in the same chamber without interruption( Si + Dielectric layer* )
*SiO2，SiN，etc - Compatible wafer:Capable of handling wafers with 200 / 300 mm ring frame
APX300-DM is a plasma dicing system that uses plasma-driven chemical reaction processes.
Unlike conventional blade dicing, it eliminates dust, debris, vibration, and water pressure, providing cleaner, higher-quality processing.
Unlike conventional blade dicing, it eliminates dust, debris, vibration, and water pressure, providing cleaner, higher-quality processing.
APX300-DM Plasma Dicer
Strengths and Features
Processing examples
Other various processing examples
Main Specifications
| APX300-DM Plasma dicer | |
|---|---|
| Plasma source | ICP ( Inductive Coupled Plasma ) |
| Process gas | 4 Line ( standard ) ( Maximum 6 lines : Fluoride Gas , Ar , O2 , He , etc. ) |
| Wafer size | φ200 mm or φ300 mm with ring frame ( standard ) |
Footnotes
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