Environmentally Friendly, High Durability, Fast Curing at Low Temperatures
Electronic Materials Series
Support for New Methods, Quality Assurance, and a Wide Range of High-difficulty Mounting
Search by application and purpose (for mounting)
Search by application and purpose (semiconductor related)
[For mounting] Self-aligning adhesive
Double-sided reflow PCB improves freedom of component placement and contributes to PCB miniaturization
- Double-sided reflow PCB prevents components from falling during inverted mounting
- Supports large, top-mounted components
[For mounting] BGA/CSP reinforcement methods and materials
We propose the best reinforcement method for each application
- Corner bonding:
Efficiently alleviates stress on solder bumps at corners
Shortens process time and makes repair work easier - Under-fill: Low temperature curing with minimal component damage
[For mounting] Low-temperature curing conductive adhesive
Low-temperature curing process expands the adoption scope of components and base materials
- Low temperature curing (100ºC to 180ºC) reduces thermal damage on components
- Good electrical conductivity due to silver filler
- Does not use solvents that cause bleed-out
[Semiconductor related] Conductive adhesive
Providing quick curing pastes that can contribute to improved productivity and energy conservation
Features common to the DBC series
- Almost no dripping or stringiness
- Low-temperature (100°C or so) and quick (180 sec. or so) curing
- One-component so it’s easy to work with
- Does not use solvents that cause bleed-out
- Uses silver fillers with good conductivity and negligent impact on oxidation
[Semiconductor related] Insulating adhesive
Providing quick curing pastes that can contribute to improved productivity and energy conservation
Features common to the DBN series
- No dripping or stringiness
- Low-temperature (100°C to 150°C) and quick (1 to 20 min.) curing
- One-component so it’s easy to work with
- Does not use solvents that cause bleed-out