COG/FOG Dual-purpose Bonder FPX305CG
COG/FOG Dual-purpose Bonder FPX305CG
COG/FOG bonder for LCDs up to 32 inches
- COG/FOG bonder for LCDs compatible with automotive panels (up to 32 inches)
- Bonder to achive high productivity by simultaneous transport of 2 panels for automotive, notebook, and tablet panels (up to 17 inches)
- Integrated IC/TCP supply unit supports 2 bonding modes (COG/FOG)
Specifications
| Model No. |
NM-EFL1XC( Normal Flow : Left to Right ) |
|---|---|
| Panel Size |
L 410× W 260～L 800 ㎜× W 500 ㎜㎜ ( equal to 17- to 32-inch ) |
| Cycle Time ※1 |
IC bonding : 7.5 s / panel ( Final bonding time : 5 s ) TCP bonding : 7.5 s / panel ( Final bonding time : 5 s ) |
| Final Bonding Accuracy ※2 |
COG bonding : XY : ±5 μm / 3σ after final bonding TCP bonding : XY : ±5 μm / 3σ after final bonding |
| ACF Size | Width 0.8 mm to L 2.0 mm Reel diameter : Max.φ230 mm |
| IC Size | L 7× W 0.7 × t 0.3 ～L 35 ㎜ × W 1.5 ㎜ × t 1.0 ㎜ |
| TCP Size | L 14 × W 20 × t 0.04 L 64 ㎜ × W 50 ㎜ × t 0.1 ㎜ |
| Press Specification ※3 Temperature |
ACF attachment process：40 ～ 150 ℃ Pressure 20 ～ 160 N Pre-bonding process：40 ～ 120 ℃ Pressure 10 ～ 50 N Final bonding process：40 ～ 320 ℃ ( Backup stage：40 ～100℃ ) Pressure 50 ～ 400 N（Option 500N） |
| Power Source | 3-phase AC 200 / 220 / 380 / 400 V、 50 / 60 Hz、 8.0 kVA |
| Pneumatic Source | 0.45～0.7MPa、Main unit： 300 L / min ( A.N.R. ) Supply unit ( TCP supply unit only ) ： 200 L / min ( A,N.R ) |
| Vacuum Source | -0.08～-0.1 MPa × 2 lines、 240 L / min ( Total suction flow rate ) |
| Dimensions ※4 |
W 8 620 mm × D 2 350 ㎜ × D 1 950 ㎜（Including TCP supply unit ） |
| Mass ※5 |
Main Unit：3 200 ㎏ Fina-Bonding Unit：1 920 ㎏ TCP Supply Unit：700 ㎏ |
| Footnote | ※1 For 4 ICs ( 3+1 ) or 4TCP (3+1) on 2-side bonding and double-panel transport.Varies depending on the operating conditions such as those for the process. ※2 Based on our workpieces used for evaluation purposes ※3 Tool temperature ※4 Excluding the signal tower ※5 Varies depending on the optional configuration. |
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