COG/FOP Dual-purpose Bonder FPX007CG/FP
FPX007CG/FP is a bonder that covers a wide range of applications from narrow bezel LCDs to flexible AMOLED panels and future COP bonding.
- COG/FOP dual-purpose bonder supporting panel size of 1-inch to 8-inch
- By changing component supply units four different bonding patterns (COG/FOG/FOP/COP) are enabled
- Realization of FOP bonding as good in bonding quality/productivity as COG bonding
- Paired line composed of normal (left to right)/reverse (right to left) ﬂows realize factory management