Dry Etching Equipment APX300 (S Option)

APX300 (S option) is a dry etching equipment specialized in compound/non-volatile material processing, which can handle wafers from ⌀2" to 8" and odd-form PCBs. Two types of transfer methods can be selected. (Atmospheric transfer and vacuum load lock)

Features

• Two types of plasma sources support high-speed and high-accuracy processing
  Enables high-speed deep hole drilling of compound materials (through-PCB) and processed film thickness control
• The addition of an usher chamber and rinse chamber enables metal processing without residue or corrosion 
• Stable processing of non-volatile materials by an in-situ top plate deposit removal function

Application

• Power devices, SAW, communication devices, MEMS, sensors
  (SiC, GaN, GaAs, Al, Au, Pt, PZT, etc.)