Semiconductor Demonstration Center (Suzhou)

Process Validation

• The laboratory is equipped with various process assembly equipment such as plasma cleaning machines, thermocompression bonding machines, ultrasonic bonding equipment, and C4 equipment, and can support customers in validating product processes.
• Inspection equipment such as X-RAY, push testers, and microscopes can be used to verify the quality of prototype samples.

New process development

• Ink-Jet Printer: A new printing device capable of printing a variety of materials such as OLED, QLED, and perovskite, supporting innovative process development.
• Chip on Glass: Large-size thermocompression bonding equipment for FPD driver chip packaging.

Skill Training

• By using the laboratory equipment, Panasonic senior experts provide in-depth skills training for customer engineers and offer skill certification to enhance the customer’s technical capabilities.