Device-related Systems – APX300-PD Plasma Dicer
APX300-PD Plasma Dicer
Realizes automation and high productivity in semiconductor factories
APX300-PD Plasma Dicer
Main Features
- System: Multi-chamber system with up to four chambers (Class 10 compatible), ideal for mass-production lines. Clean dicing free of particulates.
- Chamber (plasma source):Equipped with a Dual-Enhanced plasma source, achieving excellent dicing uniformity through controlled distribution of high-density plasma.
- Dicing performance:Utilizes in-situ wafer temperature measurement to achieve low-damage, high-speed dicing through precise temperature control.
Si : Etching rate ≧ 35 um / min
SiO2 : Etching rate ≧ 0.5 um / min - Compatible wafer:Capable of handling 300 mm wafers and wafers with 300 mm ring frame.
APX300-PD is a multi-chamber system that realizes automation and high productivity in semiconductor factories. Panasonic's proprietary chamber has been further evolved to achieve high-speed, highly uniform dicing, contributing to clean processing, which is important for the production of cutting-edge semiconductors.
APX300-PD Plasma Dicer
Strengths and Features
Plasma dicing solution
Main Specifications
| APX300-PD Plasma Dicer | |
|---|---|
| Plasma source | ICP ( Inductive Coupled Plasma ) |
| Process gas | 8 Line ( standard ) ( Fluoride Gas, Ar, O2, He, etc. ) |
| Wafer size | φ 300 mm or φ 300 mm with ring frame |
Footnotes
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