MD-P200 Die Bonder
Specifications
| MD-P200 Die Bonder | |
|---|---|
| Model Number | NM-EFD1B |
| Placement Accuracy | XY ( 3σ at Panasonic conditions ) : ±7 μm ( Flip bonding ) , ±15 μm ( With pre-centering ) , ±25 μm（Direct bonding ) |
| Substrate dimensions | L 50 mm × W 30 mm to L 280 mm × W 140 mm ( For thermosonic : L 200 mm × W 150 mm ) |
| Die dimensions (mm) | L 0.25 mm × W 0.25 mm to L 6 mm × W 6 mm |
| Die Supply | Wafer frame , Pre-expanded ring , Tray |
| Bonding Load | Pneumatic head : 0.5 N to 10 N ( Option : 1 N to 50 N ) VCM head for thermosonic process : 1 N to 50 N ( Option : 2 N to 100 N ) |
| Head Heating | Constant heating , Up to 250 ℃ for the pneumatic head , Up to 300 ℃ for the VCM head |
| Substrate Heating | Constant heating , Up to 300 ℃ |
| Power Source | 3-phase AC 200 V ±10V , 50 / 60 Hz , Up to 4 kVA（Up to 7 kVA for heating specification ) |
| Pneumatic Source | 0.5 MPa , 30 L / min ( A.N.R. ) ( Up to 150 L / min for full-featured machine including cooling air ) |
| Dimensions (mm) | Standard specification ( Up to 200 mm substrate length. Including loader / unloader ) W 1 950 mm × D 1 190 mm × H 1 720 mm ( Machine body : W 1 190 mm × D 1 190 mm × H 1 720 mm ) |
Footnotes
Please refer to the specifications on details.