等离子切割机 APX300-DM
APX300-DM使用利用离子的化学反应工艺进行加工，不会产生现有的利用叶片的机械性灰尘、碎屑、振动、水压，提供清洁的加工方案。
- 对晶圆全面进行整体无损切割，实现高强度的晶片分割
- 通过Panasonic独特工艺，能够进行各种类半导体晶圆切割
- 根据生产量，可以把单式反应槽系统扩展为多式反应槽系统
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展会和研讨会信息
汇总刊载正在举办中的研讨会和展会信息。同时还会刊载过去的研讨会和展会信息。
需要注册会员才可下载资料。
注册会员后可以浏览本公司网站上的所有资料。
汇总刊载正在举办中的研讨会和展会信息。同时还会刊载过去的研讨会和展会信息。
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